Optomec Solution for 3D interconnect apps to be featured

ALBUQUERQUE, USA: Optomec announced that Ken Vartanian, Optomec marketing director, will give a presentation titled “Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications” at the IMAPS 44th International Symposium on Microelectronics. The symposium is being held from October 9-13 at the Long Beach Convention Center in Long Beach, Calif.

The Symposium is organized by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2011 will feature technical tracks on 3D Packaging; Modeling, Design and Reliability; Next Generation Materials; Assembly and Packaging; Advanced Technologies; and a Focus Track on Advanced Packaging and System Integration. Sessions include: 3D-TSV Processes and Materials; 3D TSV Interposers; 3D Packaging/Applications; Signal and Power Integrity; Package Reliability; Microwave/RF; Advanced Materials; Ceramic and LTCC; Thermal Management; Wire Bonding; Printed Electronics; Substrate Materials for Semicon/Solar; MEMS Packaging; and many more.